Qualcomm Technologies has released a “breakthrough micro-power” Wi-Fi system-on-chip (SoC) for battery-powered IoT, plus new “AI-ready” IoT and industrial platforms at this year’s Embedded World, taking place this week in Nuremberg, Germany. It said the new products, the QCC730 SoC Wi-Fi solution and the RB3 Gen 2 Platform, will provide “critical upgrades” to enable on-device AI in higher-performing low-power IoT products and applications. Samples ship in June 2024.
