At CES, VP and GM of Qualcomm’s Mobile & Compute Connectivity Business Unit Dino Bekis spoke with RCR Wireless News about the company’s FastConnect 6800 Mobile Connectivity Subsystem, an advanced 14nm 2×2 Mobile Connectivity SoC with Wi-Fi 6 and Bluetooth, as well what to expect from Wi-Fi 6 in the new year.
The latest iteration of the FastConnect Subsystem, the 6800 version, which the company demoed at its Wi-Fi 6 day in August, is designed to deliver faster, more secure and more robust Wi-Fi experiences and enable new Bluetooth audio capabilities, including LE Audio, a critical update to Bluetooth technology announced at this year’s CES.