Last month, MediaTek announced its first SoC for 5G flagship smartphones, the Dimensity 9200. This week, the company has revealed yet another chipset in the lineup: The Dimensity 8200. The new chipset is designed for premium 5G smartphones and is built on TSMC’s 4nm fabrication technology. According to the company, the 8200 delivers “unparalleled” power efficiency and an enhanced gaming experience. It also supports carrier aggregation to amplify sub-6GHz performance, as well as tri-band Wi-Fi 6E.
“The MediaTek Dimensity 8200 will enhance the gaming experience on premium 5G smartphones, and will deliver smoother gameplay with higher framerates, impressive graphics, and seamless connectivity,” said CH Chen, deputy general manager of MediaTek’s Wireless Communications business unit.
