Two multi-billion deals are set to impact the wireless industry as chipmakers become increasingly focused on the “Internet of Things.”
Qualcomm plans to invest up to $3 billion in a joint venture with Japan’s TDK Corporation to integrate RF front-end modules and filters into chipsets for mobile devices and other connected devices, including drones, robots and automobiles. The venture will be 51% owned by Qualcomm, which will have the option to buy TDK’s 49% stake two and a half years after the transaction closes.
